This compact thermal control system is specifically developed for small satellites such as CubeSats and microsatellites under 100 kg. Despite its minimal size—less than 1U in volume and approximately 1 kg in mass—it delivers exceptional performance, removing 40 to 100 watts of heat using only 2 to 5 watts of electrical input power. This allows satellite operators to manage high thermal loads without compromising limited onboard power budgets or system volume.

Thanks to its efficient design, the system is ideal for missions where thermal control is critical but available space and power are severely limited. It enables stable operating conditions even in the most compact platforms, supporting advanced payloads and extending mission lifetime.

Flexibility is a core strength of this thermal control solution. Its design includes highly flexible tubing that allows for mechanical decoupling between payloads and the satellite frame, preventing stress on sensitive electronics like printed circuit boards during launch vibrations or mechanical shocks. This not only protects critical hardware but also simplifies integration within a variety of platform architectures.

Scalability is built in, with the system capable of being extended to handle up to 200 watts of thermal dissipation. This makes it suitable for both small-scale CubeSats and larger, more demanding microsatellite missions. Redundancy of moving components ensures long-term operational reliability—an essential factor for missions that may last several years or venture far from Earth, where servicing is not an option.

With its compact design, high efficiency, mission versatility, and robust reliability, this thermal control system is a key enabling technology for the next generation of small satellite missions.